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Morrison Hershfield > Newsroom > Seminars
Thermal Performance of Three-Dimensional Building Envelope Assemblies and Details
Speaker          Patrick Roppel, P.Eng., Building Science Engineer, Morrison Hershfield
Date

October 6, 2011

Event Fenestration, Window and Door Inaugural Conference 2011
Host Window and Door Manufacturers Association of British Columbia          
Location Surrey, BC
Info http://wdma-bc.org/events.shtml
Evaluating the thermal performance of complex three-dimensional architectural details at intersections of walls, windows and roofs is complex because heat flow through thermal bridges occurs in three dimensions.  Three-dimensional heat transfer modeling (3D modeling) can provide accurate solutions to questions that are not easily answered by other methods. This presentation shows how manufacturers and designers can utilize 3D modeling for product development and to demonstrate code compliance.  
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